岗位描述：

1. Applying expertise and technology to make process management to fulfill quality, cost, yield, capacity, delivery requirement

运用专业知识和技术进行过程管理，以满足质量、成本、良率、产能和交货要求

2. Delivering excellence process control through accuracy, rigor, and innovation

通过精确、严格和创新提供卓越的过程控制

3. Provide Technical support to production line, relevant process sustaining to ensure process in good condition为生产线提供技术支持，相关工艺维护，确保工艺状态良好

4. Make advanced data analysis, DOE study of process parameters to ensure process control in excellent condition 对工艺参数进行先进的数据分析和DOE研究，确保工艺控制处于***状态

5. New equipment buyoff, new DM & IDM introduction and release, new employee certificate to production line新设备验收，新DM和IDM的引进和发布，对生产新员工进行考核

6. New process setup and introduction新工艺的建立和引进

7. Make continue improvement projects to fulfill key indicators of Quality/Cost / Delivery / Capability etc.制定持续改进项目，以完成质量/成本/交货/能力等关键指标

8. Investigate, analyze, report, and follow up quality cases

调查、分析、报告和跟进质量问题事件

9. PFMEA, Control Plan, SOP, WI, OCAP generation and update PFMEA，控制计划，SOP, WI, OCAP的生成和更新

10. Other tasks assigned by manager and supervisor

完成经理和主管安排的其他任务

岗位要求：

1. Bachelor’s degree or above

本科及以上学历

2. 5 years or above semiconductor backend process related working experience

5年及以上半导体后端工艺相关工作经验

3. Major in electronics or materials science or physics

电子、材料科学或物理专业

4. Familiar with backend processes, Especially Wire Bonding process.

熟悉后道封装工艺，尤其焊线工序。

5. Familiar with the FMEA / CP/OCAP/SPC tools

熟悉FMEA / CP/OCAP/SPC工具

6. Good team and project player, lean 6 sigma green/yellow belt project experience is preferred

良好的团队和项目参与能力，有精益6西格玛绿/黄带项目经验者优先

7. Good skill on writing & Speaking English, office software and reporting

良好的英语听说读写能力，办公软件和报告能力

8. Good skill on communication in internal & external team

良好的内部和外部团队沟通能力