ams OSRAM · OS

红包职位-Staff Engineer, Product design&Process integration

薪资面议  /  经验不限  /  无锡

2024-02-21 更新

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职位属性

  • 招聘类型:社招
  • 工作性质:全职

职位描述

Position Summary (岗位描述)

Product design and process integration to ensure New Product/Process/Material are meeting requirement, stable and well-integrated into manufacturing line with all quality & reliability issue assessed and addressed prior release for product launch.

负责产品封装设计和工艺整合以满足新产品/工艺和材料符合开发要求,在产品量产前进行质量和可靠性评估使其稳定和完好地整合到产线。

Key Responsibility (主要职责)

1. Leading Package design and process integration, leading design &DFMEA review with global team

领导LED封装设计和工艺整合,领导与国际团队的设计FMEA的评审

2. Generate and maintain building block knowledge and sharing, Leading for X-projects Building Block development for existing platform

生成和维护封装构成要素的知识并分享,领导针对已有产品平台的X项目的封装构成要素的开发。

3. Ensure synergies (standardize & minimize number of qualified materials) for new product/package platform, taking care on platform fitness and development, leading platform technical risk assessment

确保新产品和新产品平台的协同效应(标准化&尽量减少认证材料),关注产品平台的健康与发展,领导产品平台的技术风险评估。

4. Enable and support Dt-X(design to cost/test/manufacturability)

确保和支持设计符合成本/测试/可制造性的要求

5. Define Building Block design rules, regular alignment between site PDI's

制定封装构成要素的设计规则并定期性地与全球PDI协调一致。

6. Triger necessary projects for performance improvement for existing product/package platform (past Q5), Develop derivates/improve platform (test new materials, …)

启动已有产品/产品平台绩效改善项目(Q5以后),开发衍生产品/改善产品平台(如测试新材料)

7. Consultant and supporting technical issues/complaints related to design from operation

对来自运营部门的与设计相关的技术问题/客户投诉提供技术咨询和支持

8. Other tasks assigned by Supervisor

主管安排的其他工作

任职条件

Qualification (任职者要求)

1. Bachelor degree or Master in Electrical /Electronic Engineering /semiconductor field

电子/电气工程,半导体领域的学士或硕士学位

2. Above 8years working experience in LED process like die bonding, wire bonding, casting/molding, Trim &From and Sawing.

8年以上的LED工艺经验,如芯片贴片工艺,引线键合工艺,注胶/塑封工艺,切筋成型和切割工艺

3. Experienced in package design, process integration, simulation, and project management, Familiar with DFMEA, DFSS, QFD and Six Sigma

有封装设计、工艺整合、模拟和项目管理的经验,熟悉DFMEA, DFSS, QFD and Six Sigma

4. CET-4 Minimum, CET-6 preferred. Familiar with Solidworks

候选人要求通过最低英语四级,优先考虑六级,熟悉使用Solidworks

5. Can fluently use different version of office software

熟练使用不同版本的办公软件

6. Others: Able to work with stress and adapt to fast changes; Good team player.

其他:能在压力下工作并适应快速变化的工作,具有团队合作精神

职位要求

  • 学历要求:无
  • 工作经验:经验不限
  • 外语要求:不需要