1) Using all kinds of tools (Eg. Introduction program, R&D manual, learning from colleagues, department share folder, etc) to be familiarized with company structure, department, system, project and other relevant Job;

2) Leading Die bonding process development by delivering low/mid complex process and equipment solutions for assigned new products under guidance of Senior Engineering Staff/Dept Mgr;

3) Leading die bonding parameter study by DOE, generate/update the relative document like the WI, control plan and Build sheet, responsible for training to technician/operator before handover to production;

Participate in Progress review meetings providing updates and highlight key issues, and actively participating in finding solutions;

4) Escalate problems that could affect deliverables and actively seek expert assistance to ensure project stays on track;

5) Perform process characterization under guidance leading to equipment/process qualification and release;

6) Carry out process optimization tasks by DOE methodology. Utilize experience & knowledge for complex problem solving by why-why analysis and provide solution with Poke-Yoke concept.

1) University Degree in Engineering related majors;

2) Five years’ above working experience in Die bond process;

3) Familiar MFMEA, PFMEA, DOE, JMP or Minitab;

4) Familiar with ASM 833,ASM838L, Datacon 2200Evo or other Model from ASM or Datacon;

5) Can fluently use different version of office software;

6) Skilled spoken & written English for internal /external communication, CET-4 level;

7) Able to work with stress and adapt to fast changes.