Position Summary (岗位描述)

Responsible for leading advanced LED packaging design and development, focusing on COB, SMD, and high-power LED modules. Ensure optimal thermal management, optical performance, and reliability through innovative packaging solutions.

岗位概述：负责主导先进LED封装设计与开发，重点涵盖COB、SMD及高功率LED模块。通过创新封装方案，确保***散热管理、光学性能和可靠性。

Key Responsibility (主要职责)

Lead LED packaging design projects including COB and high-power modules.

主导LED封装设计项目，包括COB和高功率模块。

Develop and optimize packaging structures for thermal and optical efficiency.

开发并优化封装结构，以提高散热和光学效率。

Select and validate packaging materials such as substrates, adhesives, and encapsulants.

选择并验证封装材料，如基板、胶水和封装胶。

Perform thermal, optical, and mechanical simulations to ensure design robustness.

进行热、光学和机械模拟，确保设计稳健性。

Collaborate with cross-functional teams for product integration and performance optimization.

与跨部门团队协作，实现产品集成和性能优化。

Establish and maintain packaging process standards and documentation.

建立并维护封装工艺标准和文档。

Support reliability testing and failure analysis for continuous improvement.

支持可靠性测试和失效分析，推动持续改进。

Drive innovation in packaging technology and participate in patent applications.

推动封装技术创新并参与专利申请。

Ensure compliance with industrial and environmental regulations.

确保符合行业和环保法规。

Qualification (任职者要求)

Bachelor’s degree or above in Materials Science, Electronics, or related field.

本科及以上学历，材料科学、电子或相关专业。

8+ years experience in LED packaging or semiconductor packaging.

8年以上LED封装或半导体封装经验。

Proficiency in thermal and optical simulation tools (ANSYS, LightTools).

熟练使用热学和光学仿真工具（ANSYS、LightTools）。

Strong knowledge of packaging materials and reliability standards.

具备封装材料和可靠性标准的深厚知识。

Excellent project management and cross-functional communication skills.

具备优秀的项目管理和跨部门沟通能力。

Fluent in English and Mandarin for technical communication.

具备良好的英文和中文技术沟通能力。