Position Summary (岗位描述)

Responsible for LED packaging optical design and development, focusing on optimizing optical performance for COB, SMD, and high-power LED modules. Ensure luminous efficiency, light distribution consistency, and reliability through innovative optical solutions to support performance in lighting and display applications.

负责LED封装光学设计与开发，重点涵盖COB、SMD及高功率LED模块的光学性能优化。通过创新光学方案，确保光效、配光一致性及可靠性，支持产品在照明、显示等应用中的性能提升

Key Responsibility (主要职责)

Lead LED packaging optical design projects, including lens, encapsulant, phosphor, and optical structure development.

主导LED封装光学设计项目，包括透镜、封装胶、荧光粉及光学结构开发。

Perform optical simulation and analysis (e.g., light distribution, luminous efficiency, color consistency) to optimize packaging structure.

进行光学仿真与分析（如配光、光效、色温一致性），优化封装结构。

Select and validate optical-related materials (lens, encapsulant, phosphor) to ensure performance and reliability.

选择并验证光学相关材料（透镜、封装胶、荧光粉），确保性能与可靠性。

Collaborate with thermal, mechanical, and electrical teams to achieve overall performance optimization.

与热学、机械及电性团队协作，实现整体性能优化。

Establish and maintain optical design standards and testing specifications.

制定并维护光学设计标准及测试规范。

Support optical performance verification, reliability testing, and failure analysis to drive continuous improvement.

支持光学性能验证、可靠性测试及失效分析，推动持续改进。

Track industry optical technology trends, promote innovation, and participate in patent applications.

跟踪行业光学技术趋势，推动创新并参与专利申请。

Qualification (任职者要求)

Bachelor's degree or above in Optical Engineering, Physics, Materials, or related fields.

光学工程、物理、材料或相关专业本科及以上学历。

5+ years of experience in LED packaging optical design or related areas.

5年以上LED封装光学设计或相关经验。

Proficient in optical simulation tools (e.g., LightTools).

熟练使用光学仿真工具（如LightTools）。

Strong knowledge of optical materials and LED packaging processes.

深厚的光学材料知识及LED封装工艺理解。

Excellent project management and cross-functional communication skills.

具备良好的项目管理及跨部门沟通能力。

Fluent in both English and Chinese for technical communication.

英文及中文技术沟通能力优秀。