Position Summary (岗位描述)
Responsible for LED packaging structural design and thermal development, focusing on optimizing mechanical strength, heat dissipation performance, and reliability. Through innovative structural solutions and thermal management technologies, ensure excellent thermal performance and long-term stability in high-power applications, supporting performance improvement in lighting, display, and automotive fields. 负责LED封装结构设计与热学开发，重点优化封装结构的机械强度、散热性能及可靠性。通过创新结构方案和热管理技术，确保产品在高功率应用中具备优异的热性能和长期稳定性，支持照明、显示及汽车等应用的性能提升。
Key Responsibility (主要职责)
Lead LED packaging structural and thermal design projects, including bracket, encapsulant, pad layout, and heat dissipation path optimization.
主导LED封装结构及热学设计项目，包括支架、封装胶、焊盘布局及散热路径优化。
Perform thermal simulation and analysis (e.g., thermal resistance, junction temperature distribution, thermal failure risk) to optimize packaging structure for better heat dissipation.
进行热学仿真与分析（如热阻、结温分布、热失效风险），优化封装结构以提升散热效率。
Select and validate materials related to structure and thermal management (e.g., substrates, encapsulants, heat sinks) to ensure performance and reliability.
选择并验证结构及热管理相关材料（如基板、封装胶、散热片），确保性能与可靠性。
Collaborate closely with optical and electrical teams to align structural design and thermal management solutions with overall performance goals.
与光学及电性团队紧密协作，确保结构设计与热管理方案与整体性能目标一致。
Develop and maintain structural design standards and thermal testing specifications to ensure consistency and manufacturability.
制定并维护结构设计标准及热学测试规范，确保设计一致性和可量产性。
Support thermal performance validation, reliability testing, and failure analysis to drive continuous improvement and problem resolution.
支持热性能验证、可靠性测试及失效分析，推动持续改进和问题解决。
Track industry trends in structural and thermal management technologies, promote innovation, and participate in patent applications.
跟踪行业结构及热管理技术趋势，推动创新并参与专利申请。
