•  Responsible for backend assembly process for BG product development.

•  Work closely with BG project team, subcon management team and A/T sites to release new product.

•  Reviewer of project gates and milestones for BE process related activities and documents.

•  Review and monitor process risk assessment.

•  Drive and monitor backend industrialization projects for BG.

•  Drive and monitor backend cost down activities.

•  Define backend assembly industrial strategy for BG .

•  Support the BE production line problem solving activities.

•  Support customer compliant or customer audit when relate to assembly.

•  Bachelor’s degree or above, preferred major in Electronics or Mechanical.

•  At least 5 years of experience on Package Assembly for Analog IC and/or Logic products, familiar with common package types, incl. SOT, SOP, QFN, QFP etc.

•  Basic skills of assembly process verification and optimization (DoE, light DoE or verification experiments).

•  Skills of finding root cause, problem solving and solution implementation.

•  Experience on Automotive package development and releasing are preferred.

•  Knowledge and experience on advanced packaging technologies (e.g., WLCSP & Flip-Chip) are preferred.

•  Production line management skills will be preferred.

•  Good language skill, both Chinese and English, able to read, write, speak English with different parties. 

•  Team working spirit, good communication skill with different parties, incl. R&D, production, quality, etc.