岗位描述：

Responsible for leading advanced LED packaging design and development, focusing on COB, SMD, and high-power LED modules. Ensure optimal thermal management, optical performance, and reliability through innovative packaging solutions.

岗位概述：负责主导先进LED封装设计与开发，重点涵盖COB、SMD及高功率LED模块。通过创新封装方案，确保良好的散热管理、光学性能和可靠性。

主要职责：

-Lead LED packaging design projects including COB and high-power modules.

主导LED封装设计项目，包括COB和高功率模块。

-Develop and optimize packaging structures for thermal and optical efficiency.

开发并优化封装结构，以提高散热和光学效率。

-Select and validate packaging materials such as substrates, adhesives, and encapsulants.

选择并验证封装材料，如基板、胶水和封装胶。

-Perform thermal, optical, and mechanical simulations to ensure design robustness.

进行热、光学和机械模拟，确保设计稳健性。

-Collaborate with cross-functional teams for product integration and performance optimization.

与跨部门团队协作，实现产品集成和性能优化。

-Establish and maintain packaging process standards and documentation.

建立并维护封装工艺标准和文档。

-Support reliability testing and failure analysis for continuous improvement.

支持可靠性测试和失效分析，推动持续改进。

-Drive innovation in packaging technology and participate in patent applications.

推动封装技术创新并参与专利申请。

-Ensure compliance with industrial and environmental regulations.

确保符合行业和环保法规。

-Bachelor’s degree or above in Materials Science, Electronics, or related field.

本科及以上学历，材料科学、电子或相关专业。

-8+ years experience in LED packaging or semiconductor packaging.

8年以上LED封装或半导体封装经验。

-Proficiency in thermal and optical simulation tools (ANSYS, LightTools).

熟练使用热学和光学仿真工具（ANSYS、LightTools）。

-Strong knowledge of packaging materials and reliability standards.

具备封装材料和可靠性标准的深厚知识。

-Excellent project management and cross-functional communication skills.

具备优秀的项目管理和跨部门沟通能力。

-Fluent in English and Mandarin for technical communication.

具备良好的英文和中文技术沟通能力。