1. Support New Product Introductions by delivering assigned Process and Equipment solutions meeting or exceeding Quality and timeline targets.通过交付指定的工艺和设备解决方案，满足或超过质量和时间目标，来完成新产品的导入。

2. Contribute during project kick-off, product process review, design/drawing review, technical risk assessment, DOE Study, design FMEA, equipment specification preparation, equipment ordering, process/equipment setup, process/equipment run, handover documentation to production line, etc.参与项目启动、产品工艺评审、设计/图纸评审、技术风险评估、DOE参数研究、DFMEA评审、设备规格准备、设备采购，工艺/设备设置，工艺/设备运行，生产线交接文件等。

3. Ensure equipment 2nd source and cost savings targets be met through new supplier or new process introduction.通过引进新供应商或新工艺，确保达到节约产品成本目标。

4. Contribute to effective resolution of chronic issues through innovative or out-of-box solutions. Leading improvement projects/task for WB related issues 通过不断创新解决工艺问题,领导改善项目或任务改善、解决键合工艺相关的问题。

5. Able to Setup Wire bond machine independently and able to lead Jr, Engineer.能够独立调试键合设备和辅导初级工程师的工作。

6. Ensure self-development to continually upgrade overall performance. Represent the Wuxi Site for WB BAT core team meeting, coaching the new WB engineers提高自身发展，不断提升整体绩效。代表无锡研发在BAT键合工艺会议上发言，辅导新加入的工程师.

职位要求：

1. Bachelor's Degree in Electrical/Electronics/Mechanical Engineering or equivalent.本科学历，电气/电子/机械工程或相关专业。

2. >8 years in Semiconductor field and Wire bond process.

 8年以上半导体行业和键合工艺经验。

3. Wire bond equipment (Shinkawa, ASM or K&S) or process experience related. Familiar with LED/Semiconductor assembly process.

 熟悉键合设备(Shinkawa、ASM、K&S) 或相关工艺经验，熟悉LED/半导体组装工艺。

4. Familiar MFMEA, PFMEA, DOE, JMP or Minitab is required, Familiar with DFMEA, DFSS, QFD and Six Sigma preferred.熟练掌握MFMEA、PFMEA、 DOE、JMP、Minitab，熟悉DFMEA、DFSS、QFD和六西格玛优先。

5. Proficiency in English.英语熟练。

6. Able to work with stress and adapt to fast changes.有一定的抗压及适应能力。