Job responsibilities include working out thermal solution for new product, using Flotherm to do thermal simulation, developing thermal test plan and completing thermal test.

Essential duties

·    Work with HW/Mechanical engineer to do the concept design for new product.

·  Use thermal & Fluid simulation tools such as Flotherm to do thermal simulation.

·        Cooperate with HW/ECAD/Mechanical engineer to optimize the board placement. 

·  Search and choose cost-effective fan and thermal interface material.

·       Work with Mechanical/MPE to review the detailed manufacture process of heatsink.

·    Create thermal test and acoustic test plan, complete these tests according to schedule.

·        Solve thermal issue during NPI phase and sustaining phase.

·        Work with manufacture team to do cost down for heatsink, TIM and so on.

·    Study advanced thermal solutions such as 3D vapor chamber heatsink, liquid cooling, etc, and apply them into new product which need it.

Technical skills

·        Rich experience on Flotherm software.

·   Familiar with product development process in network equipment industry.

·        Rich knowledge on the optical module thermal solution, high power density ASIC thermal solution, fan speed control, acoustic test, wind tunnel test and thermal test.

·   Familiar with vapor chamber heatsink, heat pipe, thermo-siphon’s manufacture process.

·    Basic knowledge about advanced thermal solution such as liquid cooling solution.

·        Familiar with PCB placement design and review process.

·        Familiar with Microsoft office software.

Communication

·        Ability to communicate in English.

Major requirement

·        Candidate must possess a Bachelor degree or Master degree in Engineering Thermophysics.

·        8 + years experience in network equipment industry or other IT industry.