嵌入式软件开发工程师(J11824)

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电装中国 · 电装光庭汽车电子（武汉）有限公司

薪资面议 / 武汉

2025-04-01 更新

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公司简介

电装中国

“Crafting the Core”

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所有在招职位

所属团队

电装光庭汽车电子（武汉）有限公司

2个职位在招

职位属性

招聘类型：校招
工作性质：全职

职位描述

1. 负责仪表、座舱项目MCU的应用层、底层软件开发、通信软件开发

2. 按照公司流程，编写设计文档、结合测试用例

3. 缺陷分析与报告

任职条件

1.全日制统招四年本科及以上的2024，2025应届，电子信息、计算机、软件工程、通信工程等专业，

2.熟悉C语言开发

3.有软件的集成/调试/修改/优化经验

4.有CAN通信开发经验优先考虑

5.具备原理图、PCB读图能力

6.英语四级

公司福利

世界500强
丰富的各种技能培训
具有竞争力的薪资福利
挑战性的海外轮岗/培训机会
定制化的员工福利保障计划
逐年增多的带薪年假

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