Responsibilities:

• Ensure the quality of BECM / BMS launch event, verify launch quality during PPAP, spot issues at global and local supplier site, solve launch issues (incl. solder defect, IC defect under SEM…etc.), deliver gap assessment and track for closing the gap.

负责确保并提升投产质量，在PPAP中分阶段执行相应任务：在国内以及全球供应商驻场，发现并解决投产当中的各类问题（包括但不限于解决焊接质量，识别并引导供应商解决零部件级别问题，例如芯片缺陷等），提交问题与差距分析报告并且负责消弭差距。

• Get familiar with Ford manufacturing requirement and DV. Define manufacture requirements for suppliers. Perform assessment on the process feasibility and robustness (e.g. deep dive on SMT / wave soldering spec / workstation design sequence & logic…etc.) and summarize suppliers’ manufacturing capability during sourcing via either online meeting or on-site visit. Deliver capability and gap assessment with expertise for suppliers.

熟悉福特制造基础流程与要求，以此设立供应商生产要求。针对不同供应商产线设计与方案（SMT，波峰焊，工位设计逻辑等等）做出可行性与可靠性评判，并找出潜在问题点。运用自身产线经验与专业，针对供应商交付差距项分析

• Develop BECM DVP and conduct DV&PV at test lab, deliver qualified report.

交付并完善DV计划，现场监督执行DV&PV，交付实验报告

• Cooperate with layout team to deliver PCB layout without manufacturing issue. Deliver launch & quality issue assessment and solve together with core & application team.

与PCB布局团队一起交付符合制造要求的设计。与核心研发团队以及应用团队一起解决投产问题跟质量问题

• Travel domestic & international.

工作需要国内/国际出差与供应商常驻

• 3~5 years’ experience of ECU / phone / control related circuit board launch & validation, prefered with experience of BMS, IC failure or related design experience.

3~5年ECU或电子产品投产跟验证经验，有BMS/BECM投产经验，IC失效分析经验优先

• Familiar with PPAP and PCBA manufacturing process, general requirements and spec, including but not limited to SMT spec, IPC Class, Gage R&R..etc. Experience with solving manufacturing issues. Know-how with IC analysis tool.

熟悉PPAP与PCBA制造工艺流程，基础要求以及规范，包括但不限于：基础的SMT规范，IPC等级对应的工艺要求与结果判断，PPAP中的量具R&R等。具备解决投产与量产棘手问题的经验，了解芯片失效分析工具，能针对IC供应商提交的芯片失效报告进行分析与判断。

• Master Degree in Microelectronics Engineering/Electrical Engineering/Automation is preferred.

电子/电气/自动化硕士优先

• English Skill: Proficiency

英文要求：沟通熟练

• Strong Communication, Planning Skills and Self-Starter capable of delivering results.

希望您能有较强的沟通与计划能力，内驱力强，交付成果为导向

• Demonstrated initiative, discover the flaw in process during development. Integrity and teamwork orientation

希望您能有主动性，善于预测并纠正开发中的制造流程隐患，为人正直并具有团队合作精神。