What you will do

· The project manager is accountable to achieve defined project results.

· Lead NPI team to work on power device or package design, product development and new product qualification.

· Communicate with customers effectively on new product development, DFX and provide engineering proposals/solutions.

· Lead NPI team to execute SWR lots from FOL to Test without fail and resolve all engineering issue before mass production

· Lead cost improvement projects by introducing and qualifying new packaging materials.

· Provide coaching and technical assistant to the NPI engineering team to resolve internal and external technical unforeseen issue.

· Refine project budget as needed to ensure timeliness and fiscal responsibility

What you will need

Hard Skills:

· Bachelor’s or master's degree in engineering

· PMP/Prince2 preferred.

· Knowledge in state-of-the-art project management tools and their application

· Knowledge of semiconductor processes and packages

· Min 6-10 years’ experience in project management, semiconductor NPI, fab or assembly area. Engineering experience in both FOL and EOL assembly preferred.

· Sound knowledge in DOE, APQP, PPAP, FMEA and Statistical Process Control.

Soft Skills:

· Strong time management skills

· Delivering on commitment (PTS) – always demonstrating full accountability for project deliverables, “removing obstacles”

· Demonstrating “customer obsession” by actively looking for opportunities to reduce time to market.

· Ability to work in teams and collaborate effectively

· Ability to take initiative and drive for results

· Demonstrating “owners’ mindset”, critical judgement and the ability to build ‘winning teams’

· Good verbal and written communication skills in Englis and Chinese.