What you will do

• Partner with internal and external customers on requirements and product solutions

• Develop new and differentiating architectures, perform feasibility studies, compare competitor solutions and define IP roadmap

• Contribute to the business group roadmap by proposing and selecting IC processes and packages, optimal for product portfolio, costs and customer acceptance

• Translate product requirements into IC solutions while trading off performance, area and cost

• Define and document architecture with specifying functional and parametrical block-requirements including design for test solutions

• Work daily in local multi-functional teams of package architects, design engineers, test and product engineers, product manager and project leader

• Communicate with foundry and subcon engineering support groups to achieve technical insights in IC process and package technology capability and methods for product introductions

• Act as a accountable technical lead in complex projects, schedule and take ownership of tasks, manage design team and update daily report of progress to team and project leaders

• Perform actual design, optimization and simulations of IC blocks and top level circuits using Synopsys tools and target First Time Right designs

• Perform full statistical verification of datasheet parameters

• Guide and steer floor-planning, layout of (sub)blocks and top level layout and wiring diagram creation

• Carrying out IP bench validation and support product and test engineering with the validation of datasheet parameters

• Perform design reviews, evaluations, characterization and test results

• Create and archive project documents, technical documents and databases

• Proactively share knowledge and best practices with your design team

• Contribute to improve way of working in the R&D group

What you will need

• Proven experience with Gate Driver ICs in the area of High side/Low side, Half Bridge and Full Bridge Gate Driver products

• Master degree or PhD in Electronic Engineering

• 15+ years’ experience in Analog (Mixed Signal) Circuit Design and related design flows

• Skilled with Synopsys (preferred) or Cadence schematic design, simulator, layout and verification tooling

• Full competence with all aspects of Analog design and affinity with mixed signal designs

• Experienced in 0.5um to 0.13um technologies of the Semiconductor industry

• Experience in Plastic Package and Wafer Level Package technologies

• Own knowledge and experience with Electro Static Discharge and Latch-Up mechanisms and application of ESD protection strategies and devices

• A thorough understanding of Semiconductor Physics and Device operation

• Possesses Analytical Skills and ability to apply pragmatic approaches

• Feeling for industrialization and reporting

• Strong communication skills in English, both written and spoken

• Strong Team player with strong human relation, motivational and challenging skills

• Target driven, shows initiative, own an entrepreneurial attitude and work independently

• Preference to have experience as Team Lead and Analog Mixed Signal design