Development of highly reliable electronic assemblies and processes for Printed Circuit Board Assemblies (PCBA). Focus on PCB & press-fit technology, reliability of PCB & Press-fit, IDC (internal defect cost) reduction, etc.

•Responsibility for new and improved technologies, processes and concepts

•Technical support of local & global product development of electronic assemblies

•Support local & global production plant for assembly and interconnect processes

•Cooperation with international development locations (Germany, Hungary, Hongkong)

•Other duties as assigned

•Education: Master in material science, mechanical engineering, electrical engineering, physics or comparable studies

•Knowledge about metals, metal fatigue or ceramics or polymers and material fatigue

•Knowledge about materials processing

•Experience in lab testing and analytical methods

•Enthusiasm for innovative, technical questions and academic work.

•Well-structured way of working and quality mind-set.

•Ability to lead interdisciplinary / international teams.

•Good communication skills

•Openness for new solutions and other cultures