Job Description

In your new role you will:

•Package Design and Development: Design and develop high pin count QFP/QFN, FC BGA, and WB BGA package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products.

•Technical Advisor: Provide technical guidance and expertise to OSAT partners on package technology development, including specifying requirements, developing, verifying, and validating new or modified package technologies.

•Technical Leadership: Drive technical decision-making and set direction within OSAT for the development and pre-development of new package technologies, processes, and materials.

•Problem-Solving and Analysis: Apply a systematic approach to problem-solving, generating analysis, and hypothesis to draw conclusions and derive lessons learned.

•Project Management: Collaborate closely with subcon partners toidentify, analyze, and resolve technical issues that may impact project timelines, budgets, or scope.

Your Profile

You are best equipped for this task if you have:

•Over 10 years of experience in package development, process development(assembly and testing), and project management, with a focus on New Product Introduction (NPI) and change/transfer projects.

•Good technical knowledge of Back End processes & material knowledge in leadframe/laminate packages and interaction to the different functions(eg. design rules, direct materials and processes qualification)

•Good understanding of Automotive quality/reliability requirements and standards.

•Bachelor's or Master's degree in a relevant field, such as: Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics