Job Description

To provide technical support for new product introduction at subcons.Ensures that technical, quality, schedule and cost requirements areachieved.

In your new role you will:

•Be responsible for technical support of new product/package/new processdevelopment.

•Ensure that the project meets customer requirements in terms oftimeline, cost and quality

•Assess and mitigate technical risks

•Provide design proposal for package, lead frame, substrate and Cu-clip of new products

•Close interaction with the project manager, subcon interface, chip designer, application team, marketing and business units for new product design and project roadmaps

•Provide technical direction related to problem solving of process andreliability issues

•Closure of Package Development related deliverables and documents

•Technical Documentation thru Delta analysis DFMEA, PFMEA, Process Flow& Control plan

Your Profile

You are best equipped for this task if you have:

•Master / Bachelor Degree in Engineering and Physical Science

•5+ years of Package/Process development in semiconductor packaging

•Experience in analytical tools: Delta Analysis, DFMEA, DoE, 8D and simulation

•Proficiency in AutoCAD for 2D drawing. Knowledge using 3D software(e.g. AutoCAD 3D, Inventor, and SolidWorks) is an advantage

•Exposure to the development of a wide variety of packages: TO, QFN, CuClip, Flip Chip, SOIC, QFP

•Knowledge on package design rules, FA techniques, assembly processes

•Ability to interpret package simulation results. Knowledge on package simulation software (e.g. ANSYS, SolidWorks) for FEA & thermal analysisis an advantage

•Knowledge on DFMEA during design phase and ability to create strategy to mitigate risk

•Excellence in statistical analysis that can provide a clear directionbased on package/process DOE

•Knowledge in IP management and patent filing