Job Description

In your new role you will:

•Responsible for package development tasks in OSAT: package definition, technology integration and project

management.

•Responsible for new process development and new product introduction in OSAT. Perform technical ramp

up management for seamless transition during new product / package ramp up phases into serial production.

•Responsible for enabling of new package platform and derivatives packages, and support of technology and

package development at OSAT. This includes new subcon enabling support role.

•Responsible for OSAT change management projects (major changes) ensuring projects are executed fulfilling

project requirements.

•Identify package level opportunities for cost down and executes cost down projects

•Responsible for package platform assessment between subcons and provides mapping to in-house capability

supported by the segments and package platform managers.

•Co-ordination/support alignment of Subcon Technology roadmaps with Segments and PTI. Manages subcon

technical days with subcon partners

Your Profile

You are best equipped for this task if you have:

•Masters/Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical), Physics, Chemistry

•Min. 8 years hands-on experience in managing subcons (assembly/ process engineering) with 5 years in project

management

•Good experience of FAR, 8D, audit skills, project systematics

•Working in a cross functional team comprising different cultural background

•Good communication and presentation skills

•Able to travel on short notice to support critical topics in assembly engineering