About the job
This position will be part of the Package Technology Development and Roadmap team.
What you will do
•Responsible to define and review design specification for new package development.
•Responsible to review process integration for entire assembly process to ensure specification of final package meets product requirement.
•Responsible to ensure technical communication and information flow within the project team and guiding technical discussions.
•Responsible to align with all experts to guarantee consistent architectural concepts.
•Responsible to align with market and industrial needs, modularity and efficient architectures.
•Responsible to lead and drive complex technical discussions internal and external.
What you will need
•Degree Bachelor/Master/PhD in Mechanical Engineering/Material Sciences related or equivalent.
•Minimum 10 year experience in R&D environment especially in Semiconductor Process engineering/Design/Development.
•Knowledge of WLCSP/Embedded packages/SIP packages technologies.
•Strong knowledge in FMEA, SPC, DoE & troubleshooting skills/toolsets.
•Strong problem solving skill
•AutoCAD / Solidworks skills is an added advantage.
•The incumbent is also expected to have comprehensive knowledge process and equipment technologies related to semiconductor packaging.
•Able to actively build up and broaden own competencies and contacts, share into the organization.
•Keeping up to date with state of the art packaging, material and process developments.
•Ability to coach others
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright
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Nexperia is an Equal Opportunity/Affirmative Action Employer.
